Photolithography methods for 3D microstructures and 3D stacking devices

Main Article Content

Muhammed Hassen Ahmed

Abstract

A framework streamlining instrument for lithography is made and seemed to create 3D micro-arrangements utilizing light-film photo material resists. Since, the two technique confines in greyscale lithography: presentation partition theme and improvement timescale are settled in this way for a client indicated target 3D profile. This gives a proficient and persuading elective as opposed to standard experimentation-based framework plan. As far as possible were asserted by collecting assorted 3D micro-arrangements and the evaluations uncovered unimaginable quantized synchronization with the objective profile. Likewise, Edge-portrayed nm scale lines are organized in silicon utilizing optical lithography with benchmark materials and preparing device are impeccable with short warm copying through 3D three-dimensional (3D) Integrated Circuit structures. A CVD process is utilized to depict optical spacers with photo-resist spread to arrangement covered layers.

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How to Cite
Ahmed, M. H. . (2022). Photolithography methods for 3D microstructures and 3D stacking devices. International Journal of New Practices in Management and Engineering, 11(1S), 13–15. https://doi.org/10.17762/ijnpme.v11i1S.120
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Articles

References

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