Advanced Process Control and Critical Dimension Control in Photolithography Process
Main Article Content
Abstract
High volume, practical, assembling of cutting edge' photolithography processes requires top to bottom comprehension of Process and Process-Tool connection to accomplish Advanced Process Control (APC). The process likewise requires a tight control to keep up an ideal entryway CD. The direct loom that is right now being used in most semiconductor offices depends on administrator experience and doesn't give good control on the CD variety. Usage of a programmed input control framework in the business has been troublesome in light of the fact that the CD can't be estimated progressively finished. In this magazine, a neural complex is utilized to anticipate CD dependent on the estimations of thickness, reflectivity, refractive record, and portion. The neural network is prepared utilizing recorded information that are gathered at an assembling office. A neural scheme-based converse model of the progression is created. The opposite model is knock down with the progression model to frame a feed-forward controller.
Downloads
Article Details

This work is licensed under a Creative Commons Attribution-NoDerivatives 4.0 International License.
References
C.G. Morgante, G.A. Bums, and H.C. Hamaker, “Improved critical dimension control in 0.8-NA laser reticle writers,” Proceedings of SPIE, Vol. 4000, 2006.
K. Tsujita, A. Yamaguchi, A. Ueno, and M. Inuishi, “Improvement of CD control and resolution by optimizing inorganic ARC process,” Proceedings of SPIE, Vol. 4000, 2004.
N. Shimizu, H. Ikubo, and H. Kozawa “In process monitoring by auto focus signal of steppers,” Proc. of 4Ih Symp. Automated integrated circuits Manufact, J.B. Antony, Ed. Palo Alto, CA : Hewlett Packard Company, Vol. 89-2, pp. 296-305.